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  1. Microelectronic Packaging

    MillPack is a provider of engineering services targeting CAD layout of multi-chip modules, semiconductor packaging and high-density printed circuit boards.
    bga design0
    chip-scale package0
    flex-circuit0

    www.millpack.com - 2009-02-12

composites2 failure analysis1 fiberglass2 pcb2 medical4 engineering4 carbon2 assembly2 bga1 csp1 expert witness2 flip-chip1 composite2 chip-on-board1 biomedical2 mcm1 biotechnology2 flipchip1 engineer3 cob1

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